Display apparatus

ABSTRACT

A display apparatus includes a base layer including device counterparts and bridges, the bridges being located around the device counterparts and connecting the device counterparts to each other, an inorganic insulating layer located over the base layer and having openings exposing at least a portion of at least one of the bridges, organic layers filling the openings, wires located over the organic layers, display devices located over the device counterparts, and encapsulation films each of which has a form of an island to correspond to a corresponding one of the device counterparts, each of the encapsulation films including a first inorganic encapsulation film covering a corresponding one of the display devices, an organic encapsulation film located over the first inorganic encapsulation film, and a second inorganic encapsulation film covering the organic encapsulation film and contacting the first inorganic encapsulation film outside of the organic encapsulation film.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of U.S. patent application Ser. No.16/882,392, filed May 22, 2020, which is a continuation of U.S. patentapplication Ser. No. 16/175,740, filed Oct. 30, 2018, now U.S. Pat. No.10,693,091, which claims priority to and the benefit of Korean PatentApplication No. 10-2017-0180120, filed Dec. 26, 2017, the entire contentof all of which is incorporated herein by reference.

BACKGROUND 1. Field

Aspects of the present disclosure relate to display apparatuses.

2. Description of the Related Art

Generally, a display apparatus includes a display unit provided on asubstrate. At least a portion of the display apparatus may be configuredto be foldable or stretchable such that the display apparatus istransformed to have various shapes while being used.

However, in a general display apparatus according to the related art, adefect may occur in a display device or in a wire connected to thedisplay device due to folding or stretching.

SUMMARY

Aspects of embodiments of the present disclosure are directed to adisplay apparatus in which a display device is prevented from beingdamaged despite transformation of a substrate, and light efficiency isincreased.

Additional aspects will be set forth in part in the description whichfollows and, in part, will be apparent from the description, or may belearned by practice of the presented embodiments.

According to one or more embodiments of the present disclosure, there isprovided a display apparatus including: a base layer including devicecounterparts and bridges, the bridges being located around the devicecounterparts and connecting the device counterparts to each other; aninorganic insulating layer located over the base layer and havingopenings exposing at least a portion of at least one of the bridges;organic layers filling the openings; wires located over the organiclayers; display devices located over the device counterparts; andencapsulation films each of which has a form of an island to correspondto a corresponding one of the device counterparts, each of theencapsulation films including: a first inorganic encapsulation filmcovering a corresponding one of the display devices; an organicencapsulation film located over the first inorganic encapsulation film;and a second inorganic encapsulation film covering the organicencapsulation film and contacting the first inorganic encapsulation filmoutside of the organic encapsulation film.

In some embodiments, at least a portion of the organic encapsulationfilm has a convex lens shape.

In some embodiments, a surface of the first inorganic encapsulation filmfacing the organic encapsulation film is more hydrophobic than a surfaceof the second inorganic encapsulation film facing away from the firstinorganic encapsulation film.

In some embodiments, the display apparatus further includes ahydrophobic coating layer arranged between the first inorganicencapsulation film and the organic encapsulation film.

In some embodiments, each of the device counterparts has a quadrangularshape, and a corresponding one of the bridges is connected to each sideof each of the device counterparts.

In some embodiments, each of the bridges has a curved portion and thecurved portion is adjacent to a corresponding one of the devicecounterparts.

In some embodiments, the curved portion has a uniform radius ofcurvature.

In some embodiments, the base layer further includes peripheral regionsconnected to an edge of the device counterparts, and slits formedbetween the peripheral regions and the bridges.

In some embodiments, each of the slits includes a curved portion.

In some embodiments, the display apparatus further includes thin-filmtransistors located over the device counterparts and electricallyconnected to the display devices, wherein the wires include a samematerial as a material included in source electrodes and drainelectrodes of the thin-film transistors.

In some embodiments, the organic layers cover an edge of the inorganicinsulating layer.

According to one or more embodiments of the present disclosure, there isprovided a display apparatus including: a base layer including devicecounterparts and bridges, the bridges being located around the devicecounterparts and connecting the device counterparts to each other; aninorganic insulating layer located over the base layer and havingopenings exposing at least a portion of at least one of the bridges;organic layers filling the openings; wires located over the organiclayers; display device sets located over a corresponding one of thedevice counterparts, wherein each of the display device sets includes aplurality of display devices; and encapsulation films each of which hasa form of an island to correspond to a corresponding one of the devicecounterparts, each of the encapsulation films including: a firstinorganic encapsulation film covering a corresponding one of the displaydevices; an organic encapsulation film located over the first inorganicencapsulation film; and a second inorganic encapsulation film coveringthe organic encapsulation film and contacting the first inorganicencapsulation film outside of the organic encapsulation film.

In some embodiments, each of the plurality of display devices includesan organic light-emitting device including: a pixel electrode; anintermediate layer located over the pixel electrode and including anemission layer; and an opposite electrode located over the intermediatelayer, and in the plurality of devices included in one of the displaydevice sets, opposite electrodes are integrated with one another to forma single opposite electrode having a form of an island corresponding toa corresponding one of the device counterparts.

In some embodiments, the opposite electrode is connected to at least oneof the wires.

In some embodiments, the organic encapsulation film of each of theencapsulation films corresponds to corresponding one of the displaydevice sets.

BRIEF DESCRIPTION OF THE DRAWINGS

These and/or other aspects will become apparent and more readilyappreciated from the following description of the embodiments, taken inconjunction with the accompanying drawings in which:

FIG. 1 is a block diagram of an organic light-emitting display apparatusaccording to an exemplary embodiment of the present disclosure;

FIG. 2 is a plan view of a substrate included in the organiclight-emitting display apparatus of FIG. 1;

FIG. 3 is a plan view of a base layer included in the organiclight-emitting display apparatus of FIG. 1;

FIG. 4 is a cross-sectional view of a portion of the organiclight-emitting display apparatus of FIG. 1, taken along the line IV-IV′of FIG. 3;

FIG. 5 is a plan view of a device counterpart, that is, a portion of thebase layer of FIG. 3, and portions of bridges connected to the devicecounterpart;

FIG. 6 is a cross-sectional view taken along the line VI-VI′ of FIG. 5;

FIG. 7 is a cross-sectional view taken along the line VII-VII′ of FIG.5;

FIG. 8 is a cross-sectional view taken along the line VIII-VIII′ of FIG.5;

FIGS. 9-10 are cross-sectional views of portions of an organiclight-emitting display apparatus according to another exemplaryembodiment of the present disclosure;

FIG. 11 is a cross-sectional view of a portion of an organiclight-emitting display apparatus according to another exemplaryembodiment of the present disclosure;

FIGS. 12-14 are plan views of arrangements of sub-pixels located overdevice counterparts in organic light-emitting display apparatuses,according to exemplary embodiments of the present disclosure;

FIG. 15 is a plan view of a base layer of an organic light-emittingdisplay apparatus, according to another exemplary embodiment of thepresent disclosure; and

FIG. 16 is an enlarged plan view of the portion A of FIG. 15.

DETAILED DESCRIPTION

Reference will now be made in detail to embodiments, examples of whichare illustrated in the accompanying drawings. In this regard, thepresent embodiments may have different forms and should not be construedas being limited to the descriptions set forth herein. Accordingly, theembodiments are merely described below, by referring to the figures, toexplain aspects of the present description.

In drawings, like reference numerals refer to like elements throughoutand overlapping descriptions shall not be repeated.

FIG. 1 is a block diagram of an organic light-emitting display apparatus1 according to an exemplary embodiment of the present disclosure. FIG. 2is a plan view of a substrate 100 included in the organic light-emittingdisplay apparatus 1 of FIG. 1.

As shown in FIG. 1, the organic light-emitting display apparatus 1according to the current embodiment may include a display unit (e.g., adisplay) 300 and a driving unit (e.g., a driver) 400.

The display unit 300 may include pixels PXL, and data lines D1 to Dq andscan lines S1 to Sp connected to the pixels PXL. The pixels PXL may bepixels of a general meaning or may be sub-pixels in the currentembodiment, and also in the following embodiments and modificationsthereof. Data signals and scan signals may be applied to the pixels PXLthrough the data lines D1 to Dq and the scan lines S1 to Sp. The pixelsPXL may be electrically connected to a power supply line ELVDD or anelectrode power supply line ELVSS. For example, each of the pixels PXLmay include an organic light-emitting device (OLED), and may generatelight corresponding to the a data signal applied by a corresponding oneof the data lines D1 to Dq according to a current flowing from the powersupply line ELVDD to the electrode power supply line ELVSS through theOLED.

The driving unit 400 may include a scan driver 410, a data driver 420,and a timing controller 450.

The scan driver 410 may apply the scan signals to the scan lines S1 toSp according to a scan driver control signal SCS. For example, the scandriver 410 may apply the scan signals sequentially to the scan lines S1to Sp. The scan driver 410 may be directly formed over the substrate 100where the pixels PXL are formed, may be directly mounted on thesubstrate 100, or may be connected to the substrate 100 through aseparate element, such as a flexible printed circuit board.

The data driver 420 may generate a data signal by receiving a datadriver control signal DCS and image data DATA from the timing controller450. The data driver 420 may apply the data signals generated as such tothe data lines D1 to Dq. The data driver 420 may be directly formed overthe substrate 100 where the pixels PXL are formed, may be directlymounted on the substrate 100, or may be connected to the substrate 100through a separate element, such as a flexible printed circuit board.

When a scan signal is applied to a scan line, data signals transmittedfrom the data lines D1 to Dq may be applied to the pixels PXL connectedto the scan line, and accordingly, the pixels PXL may emit light atluminance corresponding to the applied data signals.

The timing controller 450 may generate control signals for controllingthe scan driver 410 and the data driver 420. For example, the controlsignals may include the scan driver control signal SCS for controllingthe scan driver 410, and the data driver control signal DCS forcontrolling the data driver 420. Here, the timing controller 450 maygenerate the scan driver control signal SCS and the data driver controlsignal DCS by using an external input signal. For example, the externalinput signal may include a dot clock signal DCLK, a data enable signalDE, a vertical synchronization signal Vsync, and/or a horizontalsynchronization signal Hsync.

Also, the timing controller 450 may apply the scan driver control signalSCS to the scan driver 410, and apply the data driver control signal DCSto the data driver 420. The timing controller 450 may convert image dataRGB input from an external source into the image data DATA that conformsto the specification of the data driver 420, and apply the image dataDATA to the data driver 420. The data enable signal DE may be a signalthat defines a period of time during which valid data is input, whereinone cycle may be set to one horizontal period of time of the horizontalsynchronization signal Hsync.

In FIG. 1, the scan driver 410, the data driver 420, and the timingcontroller 450 are illustrated as separate components, however, at leastsome of the components may be integrated as desired. Also, the scandriver 410, the data driver 420, and the timing controller 450 may beprovided in any one of various suitable manners, such as chip on glass,chip on plastic, tape carrier package, and chip on film.

Such various components may be arranged over the substrate 100 that isshown in FIG. 2. The substrate 100 may include an active area where animage may be displayed, and a non-active area NA around the active areaAA. The pixels PXL are located in the active area AA, and thecomponents, such as the driving unit 400, for controlling the pixels PXLmay be located in the non-active area NA. The non-active area NA may beunderstood as a non-display area.

The substrate 100 is stretchable, and thus may be stretched orcontracted in one or more directions, or may be flexible. The substrate100 may include various suitable materials having flexible, bendable, orstretchable characteristics, and for example, may include a polymerresin, such as polyethersulphone (PES), polyacrylate, polyetherimide(PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET),polyphenylene sulfide (PPS), polyarylate (PAR), polyimide (PI),polycarbonate (PC), cellulose acetate propionate (CAP), and/or the like.A configuration of the substrate 100 may vary in a suitable manner. Forexample, the substrate 100 may have a multilayer structure including twolayers, which include polymer resin, and a barrier layer, which includesan inorganic material (e.g., silicon oxide, silicon nitride, siliconoxynitride, and/or the like), provided between the two layers.

FIG. 3 is a plan view of the base layer 110, which may be located overthe substrate 100. The base layer 110 is arranged over the substrate100, and includes device counterparts DCP and bridges BR. The devicecounterparts DCP are portions of the base layer 110 over which displaydevices will be located. Each of the device counterparts DCP may be inthe form of an island. Bridges BR are located around the devicecounterparts DCP and connect the device counterparts DCP to each other.

The device counterparts DCP may be regularly arranged along a first axis(X-axis) and a second axis (Y-axis) crossing the first axis. Also, theadjacent device counterparts DCP may be connected to each other throughat least one bridge BR. FIG. 3 only illustrates a portion of the baselayer 110, and a plurality of such portions may be regularly arrangedalong the first axis and the second axis. The same is applied to thefollowing embodiments and modifications thereof. Display devices, suchas OLEDs, may be located above each of the device counterparts DCP; andwires transmitting power, electrode power, a scan signal, and/or a datasignal, which are to be applied to the display devices, may be locatedover the bridges BR.

When the substrate 100 is stretched, a distance (e.g., an interval)between the device counterparts DCP may be increased or decreased.However, even when the distance (e.g., interval) between the devicecounterparts DCP changes, a shape of each of the device counterparts DCPis not transformed or the amount of transformation of the shape may bereduced. Accordingly, the display devices located over the devicecounterparts DCP may also not be transformed or the amount oftransformation thereof may be reduced. Of course, when the substrate 100is stretched, the bridges BR connecting the device counterparts DCP maybe partially transformed. However, because the wires located over thebridges BR include a flexible metal material, the wires may not bedamaged despite the transformation.

The base layer 110 may be formed of a flexible material such that thebridges BR are not damaged even when the bridges BR are transformed. Forexample, the base layer 110 may include a polymer resin, such aspolyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethylene terephthalate (PET), polyphenylenesulfide (PPS), polyarylate (PAR), polymide (PI), polycarbonate (PC),cellulose acetate propionate (CAP), and/or the like.

In FIG. 3, each of the device counterparts DCP has an approximatequadrangular shape, but is not limited thereto, and shapes of the devicecounterparts DCP may suitably vary. Also, shapes of the bridges BRconnecting the device counterparts DCP are not limited to those shown inFIG. 3, and may suitably vary.

FIG. 4 is a cross-sectional view of a portion of the organiclight-emitting display apparatus 1 of FIG. 1, taken along the lineIV-IV′ of FIG. 3. For example, FIG. 4 is a cross-sectional viewillustrating an organic light-emitting device as a display device 310and an underlying structure located over the device counterpart DCP ofthe base layer 110 over a substrate, and is a cross-sectional view takenalong the line VI-VI′ of FIG. 3. In addition to the display device 310,a thin-film transistor (TFT) 200 electrically connected to the displaydevice 310 may be located over the device counterpart DCP as shown inFIG. 4. In FIG. 4, an OLED is located over the base layer 110, as thedisplay device 310. The OLED being electrically connected to the TFT 200may mean that a pixel electrode 320 of the OLED is electricallyconnected to the TFT 200.

The TFT 200 may include a semiconductor layer 210, a gate electrode 220,a source electrode 230, and a drain electrode 240, which includeamorphous silicon, polycrystalline silicon, or an organic semiconductormaterial. In order to obtain insulation between the semiconductor layer210 and the gate electrode 220, a gate insulating layer 140 including aninorganic material, such as silicon oxide, silicon nitride, and/orsilicon oxynitride, may be provided between the semiconductor layer 210and the gate electrode 220. In addition, an interlayer insulating layer160 including an inorganic material, such as silicon oxide, siliconnitride, silicon oxynitride, and/or the like, may be arranged over thegate electrode 220, and the source and drain electrodes 230 and 240 maybe arranged over the interlayer insulating layer 160. The gateinsulating layer 140 and the interlayer insulating layer 160 includingthe insulating material may be formed via a chemical vapor deposition(CVD) or atomic layer deposition (ALD) method. This is also applied tothe following embodiments and modifications thereof.

A buffer layer 120 including an inorganic material, such as siliconoxide, silicon nitride, and/or silicon oxynitride, may be providedbetween the TFT 200 and the base layer 110. The buffer layer 120 mayincrease flatness of a top surface of the base layer 110 or may preventor limit impurities from penetrating into the semiconductor layer 210 ofthe TFT 200 from the base layer 110 or the substrate below the baselayer 110. The buffer layer 120, the gate insulating layer 140, and/orthe interlayer insulating layer 160 may be commonly referred to as aninorganic insulating layer. This is also applied to the followingembodiments and modifications thereof.

A passivation layer 180 may be located over the TFT 200. The passivationlayer 180 may be an inorganic insulating layer including an inorganicmaterial. The inorganic material for forming the passivation layer 180may be silicon oxide, silicon nitride, silicon oxynitride, polysiloxane,and/or the like. Unlike that shown in FIG. 4, the passivation layer 180may have a curved top surface corresponding to a shape of a top surfaceof a structure below the passivation layer 180. When desired, thepassivation layer 180 may be omitted.

A planarization layer 190 may be arranged over the passivation layer180. For example, as shown in FIG. 4, when the display device 310 isarranged over the TFT 200, the planarization layer 190 may substantiallyflatten the top surface of the TFT 200. The planarization layer 190 maybe formed of an organic material, such as acryl, benzocyclobutene (BCB),hexamethyldisiloxane (HMDSO), and/or the like. The planarization layer190 is a single layer in FIG. 4, but may be variously modified in asuitable manner, and, for example, may include multiple layer.

The display device 310 may be arranged over the planarization layer 190.The display device 310 may be an OLED including, for example, the pixelelectrode 320, an opposite electrode 340, and an intermediate layer 330,which may include an emission layer and be provided between the pixeland opposite electrodes 320 and 340. The pixel electrode 320 may beelectrically connected to the TFT 200 by contacting any one of thesource and drain electrodes 230 and 240 through a contact hole (i.e., acontact opening) formed in the planarization layer 190, as shown in FIG.4.

A pixel defining layer 350 may be arranged over the planarization layer190. The pixel defining layer 350 may define a pixel by including anopening corresponding to each sub-pixel, that is, an opening exposing atleast a center portion of the pixel electrode 320. Also, in FIG. 4, thepixel defining layer 350 increases a distance between an edge of thepixel electrode 320 and an edge of the opposite electrode 340 over thepixel electrode 320 so as to prevent an arc from occurring, or reduceinstances thereof, at the edge of the pixel electrode 320. Such a pixeldefining layer 350 may be formed of an organic material, such as PI,HMDSO, and/or the like.

The pixel electrode 320 may include a transparent conductive material,such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide(ZnO), indium oxide (In₂O₃), or the like, and/or a reflective metal,such as lithium (Li), calcium (Ca), lithium fluoride/calcium (LiF/C),lithium fluoride/aluminum (LiF/AI), Al, silver A(g), magnesium (mg),gold (Au), or the like.

The intermediate layer 330 of the display device 310 may include a lowmolecular weight or high molecular weight material. When theintermediate layer 330 includes a low molecular weight material, theintermediate layer 330 may have a structure in which a hole injectionlayer (HIL), a hole transport layer (HTL), an emission layer (EML), anelectron transport layer (ETL), and an electron injection layer (EIL)are stacked in a single or complex structure, and may be formed via avacuum deposition method. When the intermediate layer 330 includes ahigh molecular weight material, the intermediate layer 330 may includean HTL and an EML. Here, the HTL may include polyethylene dioxythiophene(PEDOT), and/or the like, and the EML may include apolyphenylenevinylene (PPV)-based or polyfluorene-based high molecularweight material, and/or the like. The intermediate layer 330 may beformed via a screen printing or inkjet printing method or a laserinduced thermal imaging (LITI) method. However, the intermediate layer330 is not limited thereto, and may have any one of various structures.

The opposite electrode 340 is arranged over the intermediate layer 330.The opposite electrode 340 may include a metal film formed of Ag, Mg,Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, and/or the like; and/or a transparentconductive film formed of ITO, IZO, ZnO, indium tin zinc oxide (ITZO),and/or the like.

Because the display device 310 may be easily damaged by externalmoisture or oxygen, an encapsulation film 500 may cover the displaydevice 310 to protect the display device 310. As shown in FIG. 4, theencapsulation film 500 may include a first inorganic encapsulation film510, an organic encapsulation film 530, and a second inorganicencapsulation film 520. In particular, the encapsulation film 500 may bein the form of an island (when viewed from a plan view) to correspond tothe device counterpart DCP. Accordingly, the organic light-emittingdisplay apparatus 1 may include a plurality of the encapsulation films500 spaced apart from each other.

The first inorganic encapsulation film 510 may cover the oppositeelectrode 340 and include silicon oxide, silicon nitride, siliconoxynitride, and/or the like. When desired, other layers, such as acapping layer, may be provided between the first inorganic encapsulationfilm 510 and the opposite electrode 340. Because the first inorganicencapsulation film 510 is formed along a structure therebelow, a topsurface of the first inorganic encapsulation film 510 is not flat asshown in FIG. 4.

The organic encapsulation film 530 is located over the first inorganicencapsulation film 510, and unlike the first inorganic encapsulationfilm 510, a top surface of the organic encapsulation film 530 may beformed to have a flat or uniform shape. In particular, as shown in FIG.4, at least a portion of the organic encapsulation film 530 may have aconvex shape such that condensing efficiency of light emitted from thedisplay device 310 is increased. The organic encapsulation film 530 mayinclude at least one material selected from PET, PEN, PC, PI,polyethylene sulfonate, polyoxymethylene, PAR, and HMDSO.

An inkjet printing method may be used to form the organic encapsulationfilm 530. For example, the organic encapsulation film 530 may be simplyformed by dotting a monomer material over the first inorganicencapsulation film 510 over the opposite electrode 340 by using theinkjet printing method, and then hardening the monomer material. At thistime, to prevent or substantially prevent the dotted monomer materialfrom spreading and to maintain a lens shape during the inkjet printingmethod, the top surface of the first inorganic encapsulation film 510may be hydrophobized via a plasma process or the like before the inkjetprinting method. Accordingly, a contact angle of the dotted monomermaterial at the first inorganic encapsulation film 510 may be about 30°to about 50°. In this case, a surface of the first inorganicencapsulation film 510 facing the organic encapsulation film 530 may bemore hydrophobic than a surface of the second inorganic encapsulationfilm 520 facing away from the first inorganic encapsulation film 510. Insome examples, a coating layer may be formed over the first inorganicencapsulation film 510 by using a hydrophobic material, and then amaterial for forming the organic encapsulation film 530 may be dottedover the coating layer via the inkjet printing method.

The second inorganic encapsulation film 520 may cover the organicencapsulation film 530, and may include silicon oxide, silicon nitride,silicon oxynitride, and/or the like. The second inorganic encapsulationfilm 520 may contact the first inorganic encapsulation film 510 fromoutside of the organic encapsulation film 530 such that the organicencapsulation film 530 is not externally exposed.

As such, the encapsulation film 500 includes the first inorganicencapsulation film 510, the organic encapsulation film 530, and thesecond inorganic encapsulation film 520, and external impurities, suchas moisture or oxygen, may be prevented or substantially prevented frompenetrating into the display device 310 through such a multilayerstructure.

The light-emitting display apparatus 1 may have different cross sectionsbased on where it is viewed from; however, various layers over thedevice counterpart DCP of the base layer 110 may not extend out of thedevice counterpart DCP except for the bridges BR. Accordingly, in FIG.4, the buffer layer 120, the gate insulating layer 140, the interlayerinsulating layer 160, the passivation layer 180, and the planarizationlayer 190 have side surfaces. Also, the first inorganic encapsulationfilm 510 of the encapsulation film 500 cover such side surfaces. Whendesired, the second inorganic encapsulation film 520 may also cover theside surfaces as shown in FIG. 4. Accordingly, impurities may beeffectively prevented from penetrating into the display device 310through the side surfaces of the buffer layer 120, the gate insulatinglayer 140, the interlayer insulating layer 160, the passivation layer180, and/or the planarization layer 190. The buffer layer 120 the gateinsulating layer 140, the interlayer insulating layer 160, thepassivation layer 180, and/or the planarization layer 190 may becontinuously connected with respect to the adjacent device counterpartsDCP through the bridges BR.

FIG. 5 is a plan view of the device counterpart DCP, that is, a portionof the base layer 110 of FIG. 3, and portions of first through fourthbridges BR1 through BR4 connected to the device counterpart DCP. Asshown in FIG. 5, from the plan view, the device counterpart DCP may havean approximate quadrangular shape having first through fourth sides DCP1through DCP4. A display device, such as an OLED, described withreference to FIG. 4 may be arranged over the device counterpart DCP. Onesub-pixel may be arranged in one device counterpart DCP, or a pluralityof sub-pixels forming one pixel may be arranged in one devicecounterpart DCP. For example, in the latter case, a red sub-pixel, ablue sub-pixel, and a green sub-pixel may be arranged together in onedevice counterpart DCP.

Bridges may be connected to sides of the device counterpart DCP, whichmay be portions indicated as external edges on a plan view. For example,as shown in FIG. 5, the first through fourth bridges BR1 through BR4 maybe respectively connected to the first through fourth sides DCP1 throughDPC4 of the device counterpart DCP. The first bridge BR1 may beconnected to a portion of the first side DCP1, and extend in a firstdirection (+X direction). The first bridge BR1 may have a curved portionCA at a region connected to the first side DCP1, that is, adjacent tothe device counterpart DCP. The second bridge BR2 may be connected to aportion of the second side DCP2, and extend in a second direction (−Ydirection). The second bridge BR2 may have a curved portion CA at aregion connected to the second side DCP2, that is, adjacent to thedevice counterpart DCP. The third bridge BR3 may be connected to aportion of the third side DCP3, and extend in an opposite direction (−Xdirection) of the first direction. The third bridge BR3 may have acurved portion CA at a region connected to the third side DCP3, that is,adjacent to the device counterpart DCP. The fourth bridge BR4 may beconnected to a portion of the fourth side DCP4, and extend in anopposite direction (+Y direction) of the second direction. The fourthbridge BR4 may have a curved portion CA at a region connected to thefourth side DCP4, that is, adjacent to the device counterpart DCP.

Wires BL transmitting power, electrode power, a scan signal, and/or adata signal to be applied to the pixel PXL arranged over the devicecounterpart DCP may be provided in the first through fourth bridges BR1through BR4. The number of wires BL provided in the first through fourthbridges BR1 through BR4 may vary based on the number of display devicesarranged over the device counterpart DCP, and may also vary based on thenumber of TFTs connected to the display device. Also, the number ofwires BL arranged over the first through fourth bridges BR1 through BR4may be the same or different in the first through fourth bridges BR1through BR4.

FIG. 6 is a cross-sectional view taken along the line VI-VI′ of FIG. 5,FIG. 7 is a cross-sectional view taken along the line VII-VII′ of FIG.5, and FIG. 8 is a cross-sectional view taken along the line VIII-VIII′of FIG. 5. Hereinafter, a stacked structure of the wire BL, etc. locatedover the first bridge BR1 will be described with reference to FIGS. 6through 8.

As shown in FIG. 7, an inorganic insulating layer located over the baselayer 110 includes an opening OA exposing at least a portion of thefirst bridge BR1, that is, at least one of the first through fourthbridges BR1 through BR4. In FIG. 7, only one opening OA is illustratedbecause only a portion of the organic light-emitting display apparatus 1is shown; however, the inorganic insulating layer includes a pluralityof the openings OA throughout the organic light-emitting displayapparatus 1. Here, as described above, the inorganic insulating layer isa common name of the buffer layer 120, the gate insulating layer 140,and/or the interlayer insulating layer 160. Accordingly, the bufferlayer 120, the gate insulating layer 140, and/or the interlayerinsulating layer 160 are mainly located at the device counterpart DCP,and only portions of the buffer layer 120, the gate insulating layer140, and/or the interlayer insulating layer 160 may be located at thefirst bridge BR1. Also, when an opening of the buffer layer 120, anopening of the gate insulating layer 140, and/or an opening of theinterlayer insulating layer 160 have different sizes, it may beunderstood that a smallest opening defines the opening OA of theinorganic insulating layer.

The organic light-emitting display apparatus 1 according to the currentembodiment includes an organic layer 195 and the wires BL. The organiclayer 195 fills the opening OA of the inorganic insulating layer. Also,the wires BL are located over such an organic layer 195. Here, the wiresBL may be located over the inorganic insulating layer, such as theinterlayer insulating layer 160, where the organic layer 195 does notexist. The wires BL may be formed of the same material and at the sametime as the source or drain electrode 230 or 240 of the TFT 200 locatedover the device counterpart DCP.

The organic layer 195 may include any one of various suitable materialshaving flexible, bendable, or stretchable characteristics, for example,polymer resins such as PES, polyacrylate, PEI, PEN, PET, PPS, PAR, PI,PC, CAP, teflon, benzocyclobutene, and the like.

When the substrate 100 is stretched as described above, the distance(e.g., interval) between the device counterparts DCP may be increased ordecreased. However, even when the distance (e.g., interval) between thedevice counterparts DCP changes, a shape of each of the devicecounterparts DCP is not transformed or the amount of transformation ofthe shape may be reduced. Accordingly, the display devices 310 locatedover the device counterparts DCP may also not be transformed or theamount of transformation thereof may be reduced. Of course, when thesubstrate 100 is stretched, the bridges BR connecting the devicecounterparts DCP may be partially transformed. However, because thewires BL located over the bridges BR include a flexible metal material,the wires BL may not be damaged despite the transformation.

In addition, when the inorganic insulating layer, such as the bufferlayer 120, the gate insulating layer 140, and/or the interlayerinsulating layer 160, does not have the opening OA at the bridge BR andthe wires BL are located over such an inorganic insulating layerthroughout the bridge BR, a large stress is applied to the wires BL whenthe substrate 100 is stretched. In particular, because the hardness ofthe inorganic insulating layer is higher than that of the organic layer195, the inorganic insulating layer is highly likely to crack at thebridge BR, and when the inorganic insulating layer cracks, the wires BLover the inorganic insulating layer may also crack and thus are highlylikely to be defective, for example, become disconnected.

However, in the organic light-emitting display apparatus 1 according tothe current embodiment, the inorganic insulating layer includes theopening OA exposing at least a portion of the bridge BR, and the wiresBL are located over the organic layer 195 filing the opening OA of theinorganic insulating layer. Because the inorganic insulating layerincludes the opening OA at the bridge BR, the inorganic insulating layerhardly cracks, and the organic layer 195 seldom cracks as the organiclayer 195 includes an organic material. Accordingly, occurrence ofcracks at regions of the wires BL located over the organic layer 195,the regions being located over the bridge BR, may be prevented orreduced. Here, because the hardness of the organic layer 195 is lowerthan that of the inorganic insulating layer, stress generated bystretching of the substrate 100 may be absorbed by the organic layer195, and thus stress may be effectively prevented from being focused atthe wires BL.

When desired, the wires BL may be formed of a material different fromthe source or drain electrode 230 or 240 of the TFT 200 located over thedevice counterpart DCP. For example, the wires BL located over the firstbridge BR1 may include a material elongated more than a material of awire or conductive layer located over the device counterpart DCP suchthat the wires BL do not become defective, for example, do not becomecracked or disconnected, despite transformation of the substrate 100.Also, the wire or conductive layer located over the device counterpartDCP may include a material having excellent electric or mechanicalcharacteristics rather than excellent elongation, such that transmissionefficiency of an electric signal is increased or a defect rate duringmanufacture is decreased. For example, an electrode or conductive layerlocated over the device counterpart DCP may include molybdenum and/orthe like, and the wires BL may include aluminum and/or the like.

The organic layer 195 may cover an edge of the inorganic insulatinglayer, that is, an inner side of the opening OA of the inorganicinsulating layer. Accordingly, the wires BL may not break and may becontinuous from the first bridge BR1 to the inorganic insulating layerof the device counterpart DCP. When the organic layer 195 does not coverthe inner side of the opening OA of the inorganic insulating layer, aconductive material may not be removed but may remain in the inner sideof the opening OA where a stepped portion is formed, while a conductivelayer is formed and patterned to form the wires BL. As such, when theconductive material remains, other conductive layers may beshort-circuited. Accordingly, occurrence of defect may be blocked ordramatically reduced covering the edge of the inorganic insulatinglayer, that is, the edge of the opening OA with the organic layer 195.

In FIG. 6, wires BL1 through BL4 are arranged over the organic layer195. The wires BL1 through BL4 located over the first bridge BR1 extendin a direction that the first bridge BR1 is extending. The wires BL1through BL4 may extend up to the device counterpart DCP. The wires BL1through BL4 extending up to the device counterpart DCP may be locatedover the interlayer insulating layer 160. The wires BL1 through BL4extending from the first bridge BR1 to the device counterpart DCP may beelectrically connected to some of electrodes/wires located over theinterlayer insulating layer 160, and may also be electrically connectedto some of electrodes/wires located over the gate insulating layer 140.The wires BL1 through BL4 may be, for example, a data line, a scan line,and/or a power line.

The planarization layer 190 may be located over the wires BL1 throughBL4. The planarization layer 190 may be integrated with theplanarization layer 190 over the device counterpart DCP, and may protectthe wires BL1 through BL4 over the first bridge BR1. The planarizationlayer 190 over the first bridge BR1 may extend up to the devicecounterpart DCP as shown in FIG. 7, and cover an edge of the passivationlayer 180 of the device counterpart DCP. The wires BL1 through BL4 inthe device counterpart DCP may be protected by the passivation layer180.

In the first bridge BR1, the opposite electrode 340 is located over theplanarization layer 190. For example, the opposite electrodes 340 may beintegrated throughout the plurality of device counterparts DCP. Whendesired, the opposite electrode 340 may be in the form of an islandcorresponding to the device counterpart DCP, and the wire BL locatedover the first bridge BR1 may be connected to the opposite electrode 340in the form of an island to apply electrode power to the oppositeelectrode 340.

In addition, as shown in the cross-sectional view of FIG. 8 in adirection perpendicular to an extending direction of the first bridgeBR1, the opposite electrode 340 may cover all of side surfaces of theorganic layer 195. Accordingly, external impurities may be effectivelyprevented from penetrating into the organic light-emitting displayapparatus 1. When desired, an encapsulation film may also be locatedover a portion of the opposite electrode 340 at the first bridge BR1.

Structures of the second through fourth bridges BR2 through BR4 may bethe same or similar to that of the first bridge BR1 described above. Thenumber of wires BL located over the second through fourth bridges BR2through BR4 may be the same as, or different from, the number of wiresBL located over the first bridge BR1.

As described with reference to FIG. 5, the first through fourth bridgesBR1 through BR4 may each have the curved portion CA. The curved portionCA may be adjacent to the device counterpart DCP. The curved portion CAmay have a uniform (e.g., constant) or substantially uniform radius ofcurvature, and indented into the bridge BR. When the substrate 100 isstretched, the bridge BR is transformed, and at this time, a degree oftransformation of the bridge BR may vary based on the radius ofcurvature of the curved portion CA.

When the radius of curvature is about 15 um to about 25 um, a degree oflargest transformation of the bridge BR may be low. For example, whenthe substrate 100 is transformed to a certain degree, the degree oflargest transformation of the bridge BR decreases as the radius ofcurvature increases from about 5 um to about 20 um, and is increased asthe radius of curvature increases from about 20 um to about 35 um. Whenthe degree of transformation of the bridge BR increases, a stressapplied to structures including the wires BL located over the bridge BRis increased, and when the degree of transformation of the bridge BRdecreases, the stress applied to the structures including the wires BLlocated over the bridge BR is decreased. Accordingly, the radius ofcurvature of the curved portion BA included in the bridge BR may be fromabout 15 um to about 25 um.

FIGS. 9 and 10 are cross-sectional views of portions of the organiclight-emitting display apparatus according to another embodiment of thepresent disclosure. FIGS. 9 and 10 respectively correspond to FIGS. 7and 8, which are cross-sectional views of the organic light-emittingdisplay apparatus according to the previous embodiment.

Referring to FIGS. 9 and 10, the wires BL over the bridge BR may includethe wire BL3 that may be the electrode power supply line ELVSS. Anopening portion exposing at least a portion of a top surface of the wireBL3 is formed in the planarization layer 190 over the wire BL3, and awire contacting portion 342 may be electrically connected to the wireBL3 through the opening portion. Also, the wire contacting portion 342is electrically connected to the opposite electrode 340, therebyelectrically connecting the opposite electrode 340 to the wire BL3. Thewire contacting portion 342 is located over the bridge BR, and whendesired, a portion of the wire contacting portion 342 may be locatedover the device counterpart DCP.

FIG. 11 is a cross-sectional view of a portion of the organiclight-emitting display apparatus according to another embodiment of thepresent disclosure. FIG. 11 corresponds to FIG. 7 that is across-sectional view of the organic light-emitting display apparatusaccording to the previous embodiment.

In the previous embodiment described with reference to FIG. 7, the wiresBL extend up to the interlayer insulating layer 160 through the organiclayer 195; however, in the current embodiment, the wires BL may existonly over the organic layer 195. In FIG. 7, the wire BL3 is located onlyover the organic layer 195. In this case, a contact hole (i.e., acontact opening) exposing a portion of a gate wire 222 located over thegate insulating layer 140 may be formed over the organic layer 195 andthe interlayer insulating layer 160, and the wire BL3 may beelectrically connected to the gate wire 222 through the contact hole.The gate wire 222 may be formed of the same material and at the sametime as the gate electrode 220.

In addition, a signal line 232 may be located over the interlayerinsulating layer 160 over the device counterpart DCP, and may beelectrically connected to the gate wire 222 through a contact holeformed over the interlayer insulating layer 160 and exposing a portionof the gate wire 222. For example, the signal line 232 over the devicecounterpart DCP may be electrically connected to the wire BL3 over thefirst bridge BR1 through the gate wire 222. For example, the signal line232 may be a data line, and in this case, the wire BL3 may also beinterpreted as a part of the data line. In this case, the signal line232 may be formed of the same material and at the same time as thesource or drain electrode 230 or 240.

However, the present disclosure may be variously modified in a suitablemanner, and the signal line 232 may not be a portion of the data line,but may be a portion of a scan line or a portion of a power supply line.

FIGS. 12 through 14 are plan views of arrangements of sub-pixels locatedover the device counterparts DCP in the organic light-emitting displayapparatuses, according to some example embodiments of the presentdisclosure.

One sub-pixel may be located over one device counterpart DCP; however,embodiments of the present disclosure are not limited thereto and asshown in FIGS. 12 through 14, in some examples, a plurality ofsub-pixels may be located over one device counterpart DCP. When theplurality of sub-pixels are located over one device counterpart DCP, thesub-pixels may form one pixel. For example, a display device setincluding a plurality of display devices may be located over one devicecounterpart DCP, wherein the display device set corresponds to a pixel.

In FIG. 12, a red sub-pixel R, a green sub-pixel G, and a blue sub-pixelB are located over the device counterpart DCP. In FIG. 13, one redsub-pixel R, one blue sub-pixel B, and two green sub-pixels G arelocated over the device counterpart DCP. Here, each of the two greensub-pixels G may be located between the red sub-pixel R and the bluesub-pixel B. In FIG. 14, one red sub-pixel R, one green sub-pixel G, afirst blue sub-pixel B1, and a second blue sub-pixel B2 are located overthe device counterpart DCP. Here, the first and second blue sub-pixelsB1 and B2 may emit blue lights having different wavelengths.

In FIGS. 12 through 14, one pixel includes the red sub-pixel R, thegreen sub-pixel G, and the blue sub-pixel B; however, the presentdisclosure is not limited thereto. For example, a pixel may include asub-pixel emitting light of a wavelength other than a red sub-pixel, agreen sub-pixel, and/or a green sub-pixel. Also, the number ofsub-pixels located over the device counterpart DCP may vary.

As shown in FIGS. 12 through 14, when the display device set includingthe plurality of display devices is located over the device counterpartDCP, each of the display devices may be an OLED. Also, an oppositeelectrode may be integrated throughout the plurality of display devicesincluded in the display device set. In this case, the integratedopposite electrode may be in the form of an island corresponding to thedevice counterpart DCP where the display device set is located. Such anopposite electrode in the form of an island may be electricallyconnected to the wire BL3, that is, one of the wires BL, located overthe first bridge BR1 as described above with reference to FIGS. 9 and10. In this case, the wire BL3 may be understood as an electrode powersupply line. Also, the encapsulation film 500 in the form of an islandas described above with reference to FIG. 4 may correspond to thedisplay device set including the plurality of display devices locatedover the device counterpart DCP. For example, one encapsulation film 500in the form of an island may be arranged over the plurality of displaydevices included in one display device set.

FIG. 15 is a plan view of a base layer 110′ of an organic light-emittingdisplay apparatus, according to another embodiment of the presentdisclosure. FIG. 16 is an enlarged plan view of the portion A of FIG.15. FIG. 15 corresponds to FIG. 3 showing the plan view of the baselayer 110 of the organic light-emitting display apparatus according tothe previous embodiment.

Referring to FIG. 15, the base layer 110′ according to the currentembodiment further includes peripheral regions PR connected to theedges, that is, the first through fourth sides DCP1 through DCP4, of thedevice counterparts DCP, and slits S formed between the peripheralregions PR and bridges BR′. Each of the slits S may include a curvedportion Sr located at an end of the slit S. In the organiclight-emitting display apparatus according to the current embodiment,elongation may be adjusted by adjusting the thickness of the bridge BR′,the length of the slit S, and/or the width of the slit S.

The slit S formed between the bridge BR′ and the peripheral region PRmay include a straight portion S

and the curved portion Sr as shown in FIG. 16. The straight portion S

may extend along one direction. The curved portion Sr may be located atone end of the straight portion S

, and may curve (e.g., bend) to have a pre-set radius of curvature. Anangle θ between two ends of the curved portion Sr may change based onthe radius of curvature of the curved portion Sr or the length of thecurved portion Sr. When the substrate 100 is stretched, the bridge BR′is transformed, and at this time, a transformation rate of the bridgeBR′ may change based on the angle θ between the two ends of the curvedportion Sr.

When the angle θ between the two ends of the curved portion Sr ischanged, a largest transformation rate of the bridge BR′, measured whenthe bridge BR′ is stretched, varies. In detail, when the angle θ is 0°(when the slit S does not have a curved portion), a degree of largesttransformation of the bridge BR′ is high, that is, the bridge BR′ islargely transformed. When the angle θ increases from about 0° to about45°, the degree of largest transformation of the bridge BR′ decreases.When the angle θ increases from about 45° to about 90°, the degree oflargest transformation of the bridge BR′ is approximately constant.

When the degree of transformation of the bridge BR′ increases, stressapplied to structures including the wires BL located over the bridge BR′is increased; and on the other hand, when the degree of transformationof the bridge BR′ decreases, stress applied to structures including thewires BL located over the bridge BR′ is decreased. Accordingly, the slitS may include the curved portion Sr while the angle θ between the twoends of the curved portion Sr is between about 45° and about 90°.

According to one or more embodiments of the present disclosure, adisplay apparatus may be realized, in which a display device isprevented or substantially prevented from being damaged despitetransformation of a substrate and light efficiency is increased.

It should be understood that embodiments described herein should beconsidered in a descriptive sense and not for purposes of limitation.Descriptions of features or aspects within each embodiment shouldtypically be considered as available for other similar features oraspects in other embodiments.

It will be understood that, although the terms “first”, “second”,“third”, etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondiscussed below could be termed a second element, component, region,layer or section, without departing from the spirit and scope of theinventive concept.

Spatially relative terms, such as “beneath”, “below”, “lower”, “under”,“above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or in operation, in additionto the orientation depicted in the figures. For example, if the devicein the figures is turned over, elements described as “below” or“beneath” or “under” other elements or features would then be oriented“above” the other elements or features. Thus, the example terms “below”and “under” can encompass both an orientation of above and below. Thedevice may be otherwise oriented (e.g., rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly. In addition, it will also be understood thatwhen a layer is referred to as being “between” two layers, it can be theonly layer between the two layers, or one or more intervening layers mayalso be present.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting of the inventive concept.As used herein, the singular forms “a” and “an” are intended to includethe plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “include,”“including,” “comprises,” and/or “comprising,” when used in thisspecification, specify the presence of stated features, integers, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof. As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items.

Further, the use of “may” when describing embodiments of the inventiveconcept refers to “one or more embodiments of the inventive concept.”Also, the term “exemplary” is intended to refer to an example orillustration.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to”, “coupled to”, or “adjacent” another elementor layer, it can be directly on, connected to, coupled to, or adjacentthe other element or layer, or one or more intervening elements orlayers may be present. When an element or layer is referred to as being“directly on,” “directly connected to”, “directly coupled to”, or“immediately adjacent” another element or layer, there are nointervening elements or layers present.

As used herein, the term “substantially,” “about,” and similar terms areused as terms of approximation and not as terms of degree, and areintended to account for the inherent variations in measured orcalculated values that would be recognized by those of ordinary skill inthe art. Further, a specific quantity or range recited in this writtendescription or the claims may also encompass the inherent variations inmeasured or calculated values that would be recognized by those ofordinary skill in the art.

As used herein, the terms “use,” “using,” and “used” may be consideredsynonymous with the terms “utilize,” “utilizing,” and “utilized,”respectively.

Also, any numerical range recited herein is intended to include allsub-ranges of the same numerical precision subsumed within the recitedrange. For example, a range of “1.0 to 10.0” is intended to include allsubranges between (and including) the recited minimum value of 1.0 andthe recited maximum value of 10.0, that is, having a minimum value equalto or greater than 1.0 and a maximum value equal to or less than 10.0,such as, for example, 2.4 to 7.6. Any maximum numerical limitationrecited herein is intended to include all lower numerical limitationssubsumed therein and any minimum numerical limitation recited in thisspecification is intended to include all higher numerical limitationssubsumed therein. Accordingly, Applicant reserves the right to amendthis specification, including the claims, to expressly recite anysub-range subsumed within the ranges expressly recited herein. All suchranges are intended to be inherently described in this specification.

The display apparatus and/or any other relevant devices or components,such as the scan driver, the data driver, and the timing controlleraccording to embodiments of the present invention described herein maybe implemented utilizing any suitable hardware, firmware (e.g. anapplication-specific integrated circuit), software, or a suitablecombination of software, firmware, and hardware. For example, thevarious components of the display apparatus may be formed on oneintegrated circuit (IC) chip or on separate IC chips. Further, thevarious components of the display apparatus may be implemented on aflexible printed circuit film, a tape carrier package (TCP), a printedcircuit board (PCB), or formed on a same substrate. Further, the variouscomponents of the display apparatus may be a process or thread, runningon one or more processors, in one or more computing devices, executingcomputer program instructions and interacting with other systemcomponents for performing the various functionalities described herein.The computer program instructions are stored in a memory which may beimplemented in a computing device using a standard memory device, suchas, for example, a random access memory (RAM). The computer programinstructions may also be stored in other non-transitory computerreadable media such as, for example, a CD-ROM, flash drive, or the like.Also, a person of skill in the art should recognize that thefunctionality of various computing devices may be combined or integratedinto a single computing device, or the functionality of a particularcomputing device may be distributed across one or more other computingdevices without departing from the scope of the exemplary embodiments ofthe present invention.

While one or more embodiments have been described with reference to thefigures, it will be understood by those of ordinary skill in the artthat various changes in form and details may be made therein withoutdeparting from the spirit and scope as defined by the following claims,and equivalents thereof.

What is claimed is:
 1. A display apparatus comprising: a base layercomprising pixel regions and a cutout region between the pixel regions;display devices over the pixel regions, each of the display devicescomprising; a first electrode; an intermediate layer over the firstelectrode and comprising an emission layer; and a second electrode overthe intermediate layer, the second electrode in one of the pixel regionsbeing separated from the second electrode in a neighboring one of thepixel regions; and encapsulation layers patterned to correspond to thepixel regions, the encapsulation layers comprising: a first inorganiclayer over the second electrode; an organic layer over the firstinorganic layer; and a second inorganic layer covering the organic layerand contacting the first inorganic layer outside of the organic layer.2. The display apparatus of claim 1, wherein at least a portion of theorganic layer has a convex lens shape.
 3. The display apparatus of claim1, wherein a surface of the first inorganic layer facing the organiclayer is more hydrophobic than a surface of the second inorganic layerfacing away from the first inorganic layer.
 4. The display apparatus ofclaim 1, further comprising a hydrophobic coating layer arranged betweenthe first inorganic layer and the organic layer.
 5. The displayapparatus of claim 1, wherein the cutout region defines a connectingportion between the pixel regions, each of the pixel regions has aquadrangular shape, and the connecting portion is connected to each sideof each of the pixel regions.
 6. The display apparatus of claim 5,wherein the connecting portion has a curved portion and the curvedportion is adjacent to a corresponding one of the pixel regions.
 7. Thedisplay apparatus of claim 1, further comprising: thin-film transistorsover the pixel regions and electrically connected to the displaydevices; and a wire extended to one of the display devices, wherein thewire comprises a same material as a material comprised in sourceelectrodes and drain electrodes of the thin-film transistors.
 8. Thedisplay apparatus of claim 1, further comprising: an inorganicinsulating layer over the base layer to overlap the pixel regions whenviewed from a direction perpendicular to the base layer; and an organiclayer over a connecting portion defined between the pixel regions by thecutout region, wherein the organic layer covers an edge of the inorganicinsulating layer.
 9. The display apparatus of claim 1, furthercomprising: a wire extended to one of the display devices when viewedfrom a direction perpendicular to the base layer; and a wire contactingportion electrically connected to the wire and the second electrode ofthe one of the display devices such that the second electrode iselectrically connected to the wire through the wire contacting portion.10. The display apparatus of claim 9, further comprising an additionalinsulating layer over the wire, wherein the wire contacting portioncontacts the wire through an opening portion of the additionalinsulating layer.
 11. The display apparatus of claim 10, wherein thesecond electrode contacts the wire contacting portion on the additionalinsulating layer.
 12. The display apparatus of claim 9, wherein the wireis located over an organic layer.
 13. A display apparatus comprising: abase layer comprising pixel regions and a cutout region between thepixel regions; a plurality of display devices located in each of thepixel regions; a wire extended to the display devices when viewed from adirection perpendicular to the base layer; and a layer electricallyconnected to the wire and a second electrode of the plurality of displaydevices such that the second electrode is electrically connected to thewire through the layer.
 14. The display apparatus of claim 13, whereineach of the plurality of display devices comprises an organiclight-emitting device comprising: a first electrode; an intermediatelayer over the first electrode and comprising an emission layer; and asecond electrode over the intermediate layer, wherein in the pluralityof display devices, the second electrodes are integrated with oneanother to form a single second electrode corresponding to acorresponding one of the pixel regions.
 15. The display apparatus ofclaim 14, further comprising an insulating layer over the wire, whereinthe second electrode is over the insulating layer.
 16. The displayapparatus of claim 13, further comprising an insulating layer over thewire, wherein the layer electrically connected to the wire contacts thewire through an opening portion of the insulating layer.